STMicroelectronics ST72C215G2B6 Microcontroller, Microprocessor, FPGA Modules
ST7 ST7 Microcontroller IC 8-Bit 16MHz 8KB (8K x 8) FLASH
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
ST72C215G2B6
Detailed Description
IC MCU 8BIT 8KB FLASH 32SDIP
Package
32-SDIP (0.400", 10.16mm)
Key Features
Package / Case: 32-SDIP (0.400", 10.16mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
ST72C215G2B6 Datasheet
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Technical Specifications
STMicroelectronics ST72C215G2B6 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
ST7
RAM Size
256 x 8
Package / Case
32-SDIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3.2V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
LVD, POR, PWM, WDT
Number of I/O
22
Speed
16MHz
Alternate Parts Comparison (ST72C215G2B6 vs ST72F260G1B5 vs ST72F324K6B6 vs ST72F32AK2B6)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 32-SDIP | 32-SDIP | 32-SDIP | 32-SDIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | -10°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3.2V ~ 5.5V | 2.7V ~ 5.5V | 3.8V ~ 5.5V | 3.8V ~ 5.5V |
| Core Processor | ST7 | ST7 | ST7 | ST7 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 256 x 8 | 1K x 8 | 384 x 8 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Connectivity | SPI | SPI | SCI, SPI | SCI, SPI |
| Number of I/O | 22 | 22 | 24 | 24 |
| Oscillator Type | Internal | Internal | Internal | External |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | POR, PWM, WDT |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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