Samsung Semiconductor K4T56163QN-HCF7 DRAM
DDR2 SDRAM 256Mbit 16Mx16 800MHz 1.8V 84-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4T56163QN-HCF7
Detailed Description
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Unknown
RoHS State
Yes
Datasheet
K4T56163QN-HCF7 Datasheet
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Technical Specifications
Samsung Semiconductor K4T56163QN-HCF7 DRAM technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package / Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
84
Pcb
84
Package Length Mm
12.5
Package Width Mm
7.5
Seated Plane Height Mm
1.1
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