Samsung Semiconductor K4J10324KE-HC14 DRAM
GDDR3 DRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4J10324KE-HC14
Detailed Description
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Unknown
RoHS State
Unknown
Datasheet
K4J10324KE-HC14 Datasheet
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Technical Specifications
Samsung Semiconductor K4J10324KE-HC14 DRAM technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package / Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
136
Pcb
136
Package Length Mm
14
Package Width Mm
10
Seated Plane Height Mm
1.12
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