Samsung Semiconductor K4H510838G-HCB3 DRAM
DRAM 512Mbit DDR SDRAM 64Mx8 333MHz FBGA 60-Pin
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4H510838G-HCB3
Detailed Description
Package
FBGA
Key Features
Package / Case: FBGA; Mounting Type: Surface Mount
Lifecycle Status
Unknown
RoHS State
Yes
Datasheet
K4H510838G-HCB3 Datasheet
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Technical Specifications
Samsung Semiconductor K4H510838G-HCB3 DRAM technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package / Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Number of Pins
60
Pcb
60
Package Length Mm
12
Package Width Mm
9
Seated Plane Height Mm
1.2(Max)
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