Samsung Semiconductor K4E6E304EB-EGCF DRAM
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
K4E6E304EB-EGCF
Detailed Description
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA
Package
BGA
Lifecycle Status
Active
RoHS State
Supplier Unconfirmed
Datasheet
K4E6E304EB-EGCF Datasheet
Quick Jump:
Technical Specifications
Samsung Semiconductor K4E6E304EB-EGCF DRAM technical specifications.
General
Memory Size
16G
RoHS
Supplier Unconfirmed
Number of Pins
178
Mounting Type
Surface Mount
Operating Temperature
-25 ~ 70
Lifecycle Status
Active
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Organization
512Mx32
Alternate Parts Comparison (K4E6E304EB-EGCF vs K4A4G165WE-BIWE vs K4B4G1646D-BHMA vs K4E6E304EC-EGCG)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Memory Size | 16G | 4G | 4G | 16G |
| Number of Pins | 178 | 96 | 96 | 178 |
| RoHS | Supplier Unconfirmed | Compliant | Supplier Unconfirmed | Compliant |
| Lifecycle Status | Active | LTB | Obsolete | Obsolete |
| Automotive | No | No | No | No |
| Data Bus Width Bit | 32 | 16 | 16 | 32 |
| Dram Type | Mobile LPDDR3 SDRAM | DDR4 SDRAM | DDR3 SDRAM | Mobile LPDDR3 SDRAM |
| Number of Bits Word Bit | 32 | 16 | 16 | 32 |
| Number of IO Lines Bit | 32 | 16 | 16 | 32 |
| Organization | 512Mx32 | 256Mx16 | 256Mx16 | 512Mx32 |
| Package | BGA | BGA | BGA | BGA |
| Action |
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