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Samsung Semiconductor K4E6E304EB-EGCF DRAM

DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA

In Stock ActiveSamsung SemiconductorBGARoHS
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K4E6E304EB-EGCF
Part Number (MPN)
K4E6E304EB-EGCF
Detailed Description
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA
Package
BGA
Lifecycle Status
Active
RoHS State
Supplier Unconfirmed
Datasheet
PDF K4E6E304EB-EGCF Datasheet
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Technical Specifications

Samsung Semiconductor K4E6E304EB-EGCF DRAM technical specifications.

General

Memory Size
16G
RoHS
Supplier Unconfirmed
Number of Pins
178
Mounting Type
Surface Mount
Operating Temperature
-25 ~ 70
Lifecycle Status
Active
Automotive
No
Ppap
No
Dram Type
Mobile LPDDR3 SDRAM
Organization
512Mx32

Alternate Parts Comparison (K4E6E304EB-EGCF vs K4A4G165WE-BIWE vs K4B4G1646D-BHMA vs K4E6E304EC-EGCG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Memory Size16G4G4G16G
Number of Pins1789696178
RoHSSupplier UnconfirmedCompliantSupplier UnconfirmedCompliant
Lifecycle StatusActiveLTBObsoleteObsolete
AutomotiveNoNoNoNo
Data Bus Width Bit32161632
Dram TypeMobile LPDDR3 SDRAMDDR4 SDRAMDDR3 SDRAMMobile LPDDR3 SDRAM
Number of Bits Word Bit32161632
Number of IO Lines Bit32161632
Organization512Mx32256Mx16256Mx16512Mx32
PackageBGABGABGABGA
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