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Renesas R9A06G034VGBA#AC1 Microcontroller, Microprocessor, FPGA Modules

SOC ARM CORTEX RZ/N1L 196PIN

1,590 ActiveRenesas196-LFBGARoHS
R9A06G034VGBA#AC1 - No Image Available

Same model may have multiple batches, images only for reference.

R9A06G034VGBA#AC1
Manufacturer
Part Number (MPN)
R9A06G034VGBA#AC1
Detailed Description
SOC ARM CORTEX RZ/N1L 196PIN
Package
196-LFBGA
Key Features
Package / Case: 196-LFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF R9A06G034VGBA#AC1 Datasheet
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Technical Specifications

Renesas R9A06G034VGBA#AC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RoHS
True
Package / Case
196-LFBGA
Operating Temperature
-40°C ~ 85°C (TA)
Lifecycle Status
Active
Voltage IO
1.5V, 1.8V, 2.5V, 3.3V
Speed
125MHz
Core Processor
ARM® Cortex®-M3
Number of Cores Bus Width
1 Core, 32-Bit
RAM Controllers
DDR2, DDR3
Graphics Acceleration
No

Alternate Parts Comparison (R9A06G034VGBA#AC1 vs R5F51306ADFN#10 vs R5F5651CDDFC#30 vs R5F564MLDDFP#11)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case196-LFBGA80-LQFP176-LQFP100-LQFP
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Core ProcessorARM® Cortex®-M3RXRXv2RXv2
Speed125MHz32MHz120MHz120MHz
Mounting Type--Surface MountSurface MountSurface Mount
Supply Voltage--1.8V ~ 5.5V2.7V ~ 3.6V2.7V ~ 3.6V
Core Size--32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size--32K x 8640K x 8512K x 8
Connectivity--I²C, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USBCANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Data Converters--A/D 17x12b; D/A 2x8bA/D 29x12b; D/A 2x12bA/D 8x12b, 14x12b; D/A 2x12b
EEPROM Size--8K x 832K x 864K x 8
Number of I/O--6813678
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Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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