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Renesas R8A77860HBGV#U0 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT BGA

7,032Renesas593-BFBGARoHS
R8A77860HBGV#U0 593-BFBGA package illustration

Same model may have multiple batches, images only for reference.

R8A77860HBGV#U0
Manufacturer
Part Number (MPN)
R8A77860HBGV#U0
Detailed Description
IC MCU 32BIT BGA
Package
593-BFBGA
Key Features
Package / Case: 593-BFBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF R8A77860HBGV#U0 Datasheet
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Technical Specifications

Renesas R8A77860HBGV#U0 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RoHS
Yes
Package / Case
593-BFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Lifecycle Status
Obsolete
Voltage IO
1.25V, 1.5V, 3.3V
Speed
533MHz
Core Processor
SH-4A
Number of Cores Bus Width
2 Core, 32-Bit
RAM Controllers
DDR3, SDRAM

Related Parts Comparison (R8A77860HBGV#U0 vs R5F51306ADFN#10 vs R5F5651CDDFC#30 vs R5F564MLDDFP#11)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case593-BFBGA80-LQFP176-LQFP100-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Core ProcessorSH-4ARXRXv2RXv2
RoHSYesYesYesYes
Lifecycle StatusObsoleteNot For New DesignsActiveActive
Package593-BFBGALFQFP-80176-LQFPLQFP-100
Speed533MHz32MHz120MHz120MHz
Supply Voltage--1.8V ~ 5.5V2.7V ~ 3.6V2.7V ~ 3.6V
Core Size--32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size--32K x 8640K x 8512K x 8
Connectivity--I²C, LINbus, SCI, SPICANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USBCANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
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