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Renesas R8A77610DA01BGV#U9 System On Chip (SoC)

IC MCU

26Renesas449-FBGARoHS
R8A77610DA01BGV#U9 - No Image Available

Same model may have multiple batches, images only for reference.

R8A77610DA01BGV#U9
Manufacturer
Part Number (MPN)
R8A77610DA01BGV#U9
Detailed Description
IC MCU
Package
449-FBGA
Key Features
Package / Case: 449-FBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF R8A77610DA01BGV#U9 Datasheet
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Technical Specifications

Renesas R8A77610DA01BGV#U9 System On Chip (SoC) technical specifications.

General

RAM Size
16kB
Package / Case
449-FBGA
Peripherals
DDR
Architecture
MPU
Speed
400MHz
Core Processor
SH-4A
Connectivity
CANbus, I²C, USB

Alternate Parts Comparison (R8A77610DA01BGV#U9 vs AT94S05AL-25BQU vs MIMXRT1062CVL5B vs A2F500M3G-CSG288)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case449-FBGA144-LQFP196-LFBGA288-TFBGA, CSPBGA
Speed400MHz25 MHz528MHz80MHz
Core ProcessorSH-4A--ARM® Cortex®-M7ARM® Cortex®-M3
RAM Size16kB--1M x 864kB
ConnectivityCANbus, I²C, USB--CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTGEBI/EMI, Ethernet, I²C, SPI, UART/USART
PeripheralsDDR--Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDTDMA, POR, WDT
Operating Temperature---40°C ~ 85°C-40°C ~ 105°C (TJ)0°C ~ 85°C (TJ)
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