Renesas R7S721001VLBG#AC0 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 324FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7S721001VLBG#AC0
Detailed Description
IC MCU 32BIT ROMLESS 324FBGA
Package
324-FBGA
Key Features
Package / Case: 324-FBGA
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
R7S721001VLBG#AC0 Datasheet
Quick Jump:
Technical Specifications
Renesas R7S721001VLBG#AC0 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RoHS
Yes
Number of Pins
324
Package / Case
324-FBGA
Operating Temperature
-40°C ~ 85°C (TA)
Lifecycle Status
Not For New Designs
Voltage IO
1.2V, 3.3V
Speed
400MHz
Core Processor
ARM® Cortex®-A9
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Multimedia; NEON™ MPE
Alternate Parts Comparison (R7S721001VLBG#AC0 vs R7F7017153ABG-C#AC1 vs R7F7017154ABG-C#HC1 vs R7F7017143ABG-C#BC1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 324-FBGA | 324-FBGA | 324-FBGA | 324-FBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) |
| Core Processor | ARM® Cortex®-A9 | RH850G3KH | RH850G3KH | RH850G3KH |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Not For New Designs | Active | Active | Active |
| Package | 324-BGA | FBGA-324 | FPBGA-324 | FPBGA-324 |
| Speed | 400MHz | 240MHz | 240MHz | 240MHz |
| Series | -- | RH850/F1x | RH850/F1x | RH850/F1KH-D8 |
| Mounting Type | -- | Surface Mount | SMD/SMT | SMD/SMT |
| Supply Voltage | -- | 3V ~ 5.5V | 3V ~ 5.5V | 3V ~ 5.5V |
| Core Size | -- | 32-Bit Dual-Core | 32-Bit Dual-Core | 32-Bit Dual-Core |
| RAM Size | -- | 1.03M x 8 | 1M x 8 | 896K x 8 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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