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Renesas R7FS3A17C3A01CNB#AC0 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 1MB FLASH 64HWQFN

44,521 ActiveRenesas64-WFQFN Exposed PadRoHS
R7FS3A17C3A01CNB#AC0 64-WFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

R7FS3A17C3A01CNB#AC0
Manufacturer
Part Number (MPN)
R7FS3A17C3A01CNB#AC0
Detailed Description
IC MCU 32BIT 1MB FLASH 64HWQFN
Package
64-WFQFN Exposed Pad
Key Features
Package / Case: 64-WFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF R7FS3A17C3A01CNB#AC0 Datasheet
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Technical Specifications

Renesas R7FS3A17C3A01CNB#AC0 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
192K x 8
RoHS
Yes
Number of Pins
65
Package / Case
64-WFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
1.6V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O
52

Related Parts Comparison (R7FS3A17C3A01CNB#AC0 vs R7FS3A37A3A01CNB#AC0 vs R5F52306ADND#20 vs R5F52315CDND#U0)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case64-WFQFN Exposed Pad64-WFQFN Exposed Pad64-WFQFN Exposed Pad64-WFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.6V ~ 5.5V1.6V ~ 5.5V1.8V ~ 5.5V1.8V ~ 5.5V
Core ProcessorARM® Cortex®-M4ARM® Cortex®-M4RXv2RXv2
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size192K x 896K x 832K x 832K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveNot For New Designs
ConnectivityCANbus, EBI/EMI, I²C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USBCANbus, EBI/EMI, I²C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USBCANbus, EBI/EMI, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTGI²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Data ConvertersA/D 18x14b; D/A 1x12bA/D 18x14b; D/A 2x8b, 2x12bA/D 12x12b; D/A 2x12bA/D 12x12b; D/A 2x12b
EEPROM Size8K x 88K x 88K x 88K x 8
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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