Renesas R7F7017113ABG-C#HC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/F1KH
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7017113ABG-C#HC1
Detailed Description
Package
233-FBGA
Key Features
Package / Case: 233-FBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
R7F7017113ABG-C#HC1 Datasheet
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Technical Specifications
Renesas R7F7017113ABG-C#HC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
233-FBGA
Supplier Device Package
233-FBGA (15x15)
Peripherals
DMA, PWM, WDT
Number of I/O
174
Speed
240MHz
EEPROM Size
256K x 8
Core Processor
RH850G3KH
RAM Size
992K x 8
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