Renesas R7F7017083AFP-C#BA1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/F1KH-D8 CU QFP17
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7017083AFP-C#BA1
Detailed Description
32BIT MCU RH850/F1KH-D8 CU QFP17
Package
176-LQFP
Key Features
Package / Case: 176-LQFP
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F7017083AFP-C#BA1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7F7017083AFP-C#BA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850/F1KM-D8
RAM Size
896K x 8
Data Bus Width
32 bit
Maximum Clock Frequency
240 MHz
RoHS
True
Package / Case
176-LQFP
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Alternate Parts Comparison (R7F7017083AFP-C#BA1 vs R7S721020VCFP#AA1 vs R7S721030VCFP#AA0 vs R5S72671W144FP#V0)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 176-LQFP | 176-LQFP | 176-LQFP | 176-LQFP |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -20°C ~ 85°C (TA) |
| Core Processor | RH850G3KH | ARM® Cortex®-A9 | ARM® Cortex®-A9 | SH2A-FPU |
| Speed | 240MHz | 400MHz | 400MHz | 144MHz |
| Supply Voltage | 3V ~ 5.5V | -- | -- | 1.15V ~ 3.6V |
| Core Size | 32-Bit Dual-Core | -- | -- | 32-Bit Single-Core |
| RAM Size | 896K x 8 | -- | -- | 1.5M x 8 |
| Connectivity | CANbus, CSI, I²C, LINbus, SPI, UART/USART | -- | -- | CANbus, EBI/EMI, I²C, IEBus, SCI, SIO, SPI, USB |
| Data Converters | A/D 26x10b, 32x12b | -- | -- | A/D 6x10b |
| Oscillator Type | Internal | -- | -- | External |
| Peripherals | DMA, PWM, WDT | -- | -- | DMA, POR, PWM, WDT |
| Program Memory Type | Flash | -- | -- | ROMless |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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