Renesas R7F7016533ABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules
32BIT MCU RH850/F1KM BGA272 +105
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7016533ABG-C#BC1
Detailed Description
32BIT MCU RH850/F1KM BGA272 +105
Package
272-FBGA
Key Features
Package / Case: 272-FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F7016533ABG-C#BC1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7F7016533ABG-C#BC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850/F1x
RAM Size
512 kB
Data Bus Width
32 bit
Maximum Clock Frequency
240 MHz
RoHS
True
Package / Case
272-FBGA
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Alternate Parts Comparison (R7F7016533ABG-C#BC1 vs R7S921057VCBG#AC0 vs R7S921052VCBG#AC0 vs R7S921042VCBG#AC0)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 272-FBGA | 272-FBGA | 272-FBGA | 272-FBGA |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | RH850G3KH | ARM® Cortex®-A9 | ARM® Cortex®-A9 | ARM® Cortex®-A9 |
| Speed | 240MHz | 528MHz | 528MHz | 528MHz |
| Co Processors DSP | -- | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE |
| Display and Interface Controllers | -- | LCD, LVDS, MIPICSI2, Video | LCD, LVDS, MIPICSI2, Video | LCD, LVDS, MIPICSI2, Video |
| Graphics Acceleration | -- | Yes | Yes | Yes |
| Number of Cores Bus Width | -- | 1 Core, 32-Bit | 1 Core | 1 Core |
| Security Features | -- | AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 | AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 | AES, 3DES, GHASH, RSA, SHA1, SHA224, SHA256 |
| USB | -- | USB 2.0 (1) | USB 2.0 (1) | USB 2.0 (1) |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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