Renesas R7F7016483AFD-C#KA1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 4MB FLASH 176LFQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F7016483AFD-C#KA1
Detailed Description
IC MCU 32BIT 4MB FLASH 176LFQFP
Package
176-LQFP
Key Features
Package / Case: 176-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F7016483AFD-C#KA1 Datasheet
Quick Jump:
Technical Specifications
Renesas R7F7016483AFD-C#KA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850
RAM Size
512K x 8
RoHS
Yes
Package / Case
176-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, PWM, WDT
Number of I/O
144
Alternate Parts Comparison (R7F7016483AFD-C#KA1 vs R7S721020VCFP#AA1 vs R7S721030VCFP#AA0 vs R5S72671W144FP#V0)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 176-LQFP | 176-LQFP | 176-LQFP | 176-LQFP |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -20°C ~ 85°C (TA) |
| Core Processor | RH850G3KH | ARM® Cortex®-A9 | ARM® Cortex®-A9 | SH2A-FPU |
| Speed | 240MHz | 400MHz | 400MHz | 144MHz |
| Mounting Type | Surface Mount | -- | -- | Surface Mount |
| Supply Voltage | 3V ~ 5.5V | -- | -- | 1.15V ~ 3.6V |
| Core Size | 32-Bit | -- | -- | 32-Bit Single-Core |
| RAM Size | 512K x 8 | -- | -- | 1.5M x 8 |
| Connectivity | CANbus, CSI, I²C, LINbus, SPI, UART/USART | -- | -- | CANbus, EBI/EMI, I²C, IEBus, SCI, SIO, SPI, USB |
| Data Converters | A/D 26x10b, 32x12b | -- | -- | A/D 6x10b |
| Number of I/O | 144 | -- | -- | 104 |
| Oscillator Type | Internal | -- | -- | External |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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