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Renesas R7F7015874AFP-C#BA3 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 2MB FLASH 176LFQFP

28,136 ActiveRenesas176-QFPRoHS
R7F7015874AFP-C#BA3 176-QFP package illustration

Same model may have multiple batches, images only for reference.

R7F7015874AFP-C#BA3
Manufacturer
Part Number (MPN)
R7F7015874AFP-C#BA3
Detailed Description
IC MCU 32BIT 2MB FLASH 176LFQFP
Package
176-QFP
Key Features
Package / Case: 176-QFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF R7F7015874AFP-C#BA3 Datasheet
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Technical Specifications

Renesas R7F7015874AFP-C#BA3 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
192K x 8
Package / Case
176-QFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, PWM, WDT
Number of I/O
150
Speed
120MHz
EEPROM Size
64K x 8

Alternate Parts Comparison (R7F7015874AFP-C#BA3 vs R5F10Y47ASP#30 vs R5F565N4ADFB#10 vs R5F1016DASP#10)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case176-QFP16-SSOP144-LQFP20-LSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 5.5V2V ~ 5.5V2.7V ~ 3.6V1.6V ~ 5.5V
Core ProcessorRH850G3KHRL78RXv2RL78
Core Size32-Bit Single-Core16-Bit32-Bit Single-Core16-Bit
RAM Size192K x 8512 x 8256K x 83K x 8
ConnectivityCANbus, CSI, I²C, LINbus, SPI, UART/USARTCSI, I²C, LINbus, UART/USARTCANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, QSPI, SCI, SPI, UART/USART, USBCSI, I²C, UART/USART
Data ConvertersA/D 28x10b, 32x12bA/D 7x8/10bA/D 29x12b; D/A 2x12bA/D 6x8/10b
Number of I/O1501011113
Oscillator TypeInternalInternalInternalInternal
PeripheralsDMA, PWM, WDTDMA, LVD, POR, PWM, WDTDMA, LVD, POR, PWM, WDTDMA, LVD, POR, PWM, WDT
Action

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