Renesas R7F701411EABG#HC1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 3.75MB FLASH 484BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
R7F701411EABG#HC1
Detailed Description
IC MCU 32BIT 3.75MB FLASH 484BGA
Package
484-BBGA
Key Features
Package / Case: 484-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
R7F701411EABG#HC1 Datasheet
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Technical Specifications
Renesas R7F701411EABG#HC1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
RH850/D1M
RAM Size
512K x 8
RoHS
Yes
Package / Case
484-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 150°C (TJ)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O
199
Alternate Parts Comparison (R7F701411EABG#HC1 vs R7F701431EABG#BC1 vs R7F701462EAFB-C#KA0 vs R7F701432EABG#BC1)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Operating Temperature | -40°C ~ 150°C (TJ) | -40°C ~ 150°C (TJ) | -40°C ~ 150°C (TJ) | -40°C ~ 150°C |
| Supply Voltage | 2.7V ~ 5.5V | 3.3V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | RH850G3M | RH850 | RH850G3M | RH850 |
| Core Size | 32-Bit Single-Core | 32-Bit | 32-Bit | 32-Bit |
| RAM Size | 512K x 8 | 3.6M x 8 | 2.07M x 8 | 3.616K x 8 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB | CANbus, CSI, Ethernet, I²C, LINbus, UART/USART | CANbus, Ethernet, I²C, LINbus, SPI |
| Data Converters | A/D 20x12b | A/D 20x12b | A/D 16x12b | A/D 20x12b Sigma-Delta |
| EEPROM Size | 64K x 8 | 64K x 8 | 64K x 8 | 64K x 8 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | DMA, I²S, LCD, LVD, POR, PWM, WDT | DMA, I²S, LCD, LVD, POR, PWM, WDT | DMA, I²S, POR, PWM, Temp Sensor, WDT | POR, PWM |
| Program Memory Size | 3.75MB (3.75M x 8) | 3.75MB (3.75M x 8) | 4MB (4M x 8) | 5MB (5M x 8) |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
Suggested replacements
NXP
S32K344 PHANTOM, 257MAPBGA, PROD
NXP
IC MCU 32BIT 4MB FLASH 416MAPBGA
NXP
IC MCU 32BIT 4MB FLASH 416MAPBGA
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