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Renesas R5F564MLCGFC#V1 Microcontroller, Microprocessor, FPGA Modules

32BIT MCU RX64M 4M/512K/64K 105C

8,676 ActiveRenesas176-LQFPRoHS
R5F564MLCGFC#V1 176-LQFP package illustration

Same model may have multiple batches, images only for reference.

R5F564MLCGFC#V1
Manufacturer
Part Number (MPN)
R5F564MLCGFC#V1
Detailed Description
32BIT MCU RX64M 4M/512K/64K 105C
Package
176-LQFP
Key Features
Package / Case: 176-LQFP
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF R5F564MLCGFC#V1 Datasheet
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Technical Specifications

Renesas R5F564MLCGFC#V1 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
RX
RAM Size
512K x 8
RoHS
Yes
Package / Case
176-LQFP
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, LVD, POR, PWM, WDT
Speed
120MHz
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB

Related Parts Comparison (R5F564MLCGFC#V1 vs R7S721020VCFP#AA1 vs R7S721030VCFP#AA0 vs R5S72671W144FP#V0)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case176-LQFP176-LQFP176-LQFP176-LQFP
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-20°C ~ 85°C (TA)
Core ProcessorRXv2ARM® Cortex®-A9ARM® Cortex®-A9SH2A-FPU
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveNot For New Designs
PackageLQFP-176176-LQFP176-LQFP176-LQFP
Speed120MHz400MHz400MHz144MHz
Number of Pins--176176176
Last Modified Date--Aug 1, 2023 2:08 PM UTCAug 1, 2023 2:10 PM UTCAug 1, 2023 2:08 PM UTC
Released Date--Dec 21, 2020Jul 19, 2017Jan 12, 2020
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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