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Renesas R5F523W8BDNG#30 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 512KB FLASH 56HVQFN

32,454 ActiveRenesas56-VFQFN Exposed PadRoHS
R5F523W8BDNG#30 56-VFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

R5F523W8BDNG#30
Manufacturer
Part Number (MPN)
R5F523W8BDNG#30
Detailed Description
IC MCU 32BIT 512KB FLASH 56HVQFN
Package
56-VFQFN Exposed Pad
Key Features
Package / Case: 56-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF R5F523W8BDNG#30 Datasheet
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Technical Specifications

Renesas R5F523W8BDNG#30 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
64K x 8
RoHS
Yes
Number of Pins
57
Package / Case
56-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
29

Alternate Parts Comparison (R5F523W8BDNG#30 vs R5F523W7BDNG#30 vs R5F523W7ADNG#30 vs R7F0E01182DNG#AA0)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad56-VFQFN Exposed Pad
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V1.62V ~ 3.6V
Core ProcessorRXv2RXv2RXv2ARM® Cortex®-M0+
Core Size32-Bit Single-Core32-Bit32-Bit32-Bit Single-Core
RAM Size64K x 864K x 864K x 8128K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
ConnectivityCANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTGCANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTGCANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTGI²C, IrDA, SCI, SPI, UART/USART, USB
Data ConvertersA/D 12x12b; D/A 1x12bA/D 12x12b; D/A 1x12bA/D 12x12b; D/A 1x12bA/D 8x14b SAR
Number of I/O29292933
Oscillator TypeInternalExternal, InternalExternal, InternalInternal
Action

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