Renesas M30621FCPGP#U3C Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 128KB FLASH 80QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
M30621FCPGP#U3C
Detailed Description
IC MCU 16BIT 128KB FLASH 80QFP
Package
80-BQFP
Key Features
Package / Case: 80-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
M30621FCPGP#U3C Datasheet
Quick Jump:
Technical Specifications
Renesas M30621FCPGP#U3C Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
10K x 8
RoHS
Yes
Package / Case
80-BQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, WDT
Number of I/O
68
Speed
24MHz
Alternate Parts Comparison (M30621FCPGP#U3C vs M38227ECFP vs M38239GCFP#U0 vs DF36049GHV)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 80-BQFP | 80-BQFP | 80-BQFP | 80-BQFP |
| Operating Temperature | -40°C ~ 85°C (TA) | -20°C ~ 85°C (TA) | -20°C ~ 85°C (TA) | -20°C ~ 75°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.5V ~ 5.5V | 1.8V ~ 5.5V | 3V ~ 5.5V |
| Core Processor | M16C/60 | 740 | 740 | H8/300H |
| Core Size | 16-Bit | 8-Bit | 8-Bit | 16-Bit |
| RAM Size | 10K x 8 | 1K x 8 | 2K x 8 | 4K x 8 |
| Connectivity | I²C, IEBus, UART/USART | SIO, UART/USART | SIO, UART/USART | I²C, SCI |
| Data Converters | A/D 26x10b; D/A 2x8b | A/D 8x8b | A/D 8x8b, 8x10b | A/D 8x10b |
| Oscillator Type | Internal | External | Internal | Internal |
| Peripherals | DMA, WDT | LCD | LCD, WDT | LVD, POR, PWM, WDT |
| Program Memory Size | 128KB (128K x 8) | 48KB (48K x 8) | 48KB (48K x 8) | 96KB (96K x 8) |
| Program Memory Type | Flash | OTP | QzROM | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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