Renesas HD6417014F28V Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 112QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
HD6417014F28V
Detailed Description
IC MCU 32BIT ROMLESS 112QFP
Package
112-BQFP
Key Features
Package / Case: 112-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
HD6417014F28V Datasheet
Quick Jump:
Technical Specifications
Renesas HD6417014F28V Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
3K x 8
RoHS
True
Number of Pins
112
Package / Case
112-BQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
DMA, PWM, WDT
Number of I/O
35
Alternate Parts Comparison (HD6417014F28V vs HD6477034F20V vs HD64F7044FI28V vs HD64F7017F28V)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 112-BQFP | 112-BQFP | 112-BQFP | 112-BQFP |
| Operating Temperature | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4V ~ 5.5V | 4.5V ~ 5.5V |
| Core Processor | SH-2 | SH-1 | SH-2 | SH-2 |
| Core Size | 32-Bit Single-Core | 32-Bit | 32-Bit | 32-Bit Single-Core |
| RAM Size | 3K x 8 | 4K x 8 | 2K x 8 | 4K x 8 |
| Connectivity | EBI/EMI, SCI | UART/USART | EBI/EMI, SCI, UART/USART | EBI/EMI, SCI |
| Data Converters | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b |
| Oscillator Type | Internal | External, Internal | Internal | Internal |
| Peripherals | DMA, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, PWM, WDT |
| Program Memory Type | ROMless | PROM | Flash | Flash |
| Speed | 28MHz | 20MHz | 28MHz | 28.7MHz |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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