Renesas DS72613RB120FPV Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT ROMLESS 176LFQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS72613RB120FPV
Detailed Description
IC MCU 32BIT ROMLESS 176LFQFP
Package
176-LQFP
Key Features
Package / Case: 176-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
DS72613RB120FPV Datasheet
Quick Jump:
Technical Specifications
Renesas DS72613RB120FPV Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
SuperH® SH7200
RAM Size
32K x 8
RoHS
True
Package / Case
176-LQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 70°C (TA)
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
DMA, POR, PWM, WDT
Number of I/O
104
Alternate Parts Comparison (DS72613RB120FPV vs DS72011RW100FPV vs R7S721020VCFP#AA1 vs R7S721030VCFP#AA0)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 176-LQFP | 176-LQFP | 176-LQFP | 176-LQFP |
| Operating Temperature | -20°C ~ 70°C (TA) | -20°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | SH-2A | SH-2A | ARM® Cortex®-A9 | ARM® Cortex®-A9 |
| Speed | 120MHz | 100MHz | 400MHz | 400MHz |
| Mounting Type | Surface Mount | Surface Mount | -- | -- |
| Supply Voltage | 3V ~ 3.6V | 3V ~ 3.6V | -- | -- |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | -- | -- |
| RAM Size | 32K x 8 | 32K x 8 | -- | -- |
| Connectivity | CANbus, EBI/EMI, FIFO, I²C, IEBus, SCI, Serial Sound | CANbus, EBI/EMI, FIFO, I²C, SCI, Serial Sound | -- | -- |
| Data Converters | A/D 8x10b; D/A 2x8b | A/D 8x10b; D/A 2x8b | -- | -- |
| Number of I/O | 104 | 104 | -- | -- |
| Oscillator Type | External | Internal | -- | -- |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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