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Renesas DF3029F25V Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 512KB FLASH 100QFP

6,863 ActiveRenesas100-BFQFPRoHS
DF3029F25V 100-BFQFP package illustration

Same model may have multiple batches, images only for reference.

DF3029F25V
Manufacturer
Part Number (MPN)
DF3029F25V
Detailed Description
IC MCU 16BIT 512KB FLASH 100QFP
Package
100-BFQFP
Key Features
Package / Case: 100-BFQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DF3029F25V Datasheet
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Technical Specifications

Renesas DF3029F25V Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
H8® H8/300H
RAM Size
16K x 8
RoHS
Yes
Package / Case
100-BFQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Active
Peripherals
DMA, PWM, WDT
Number of I/O
70

Related Parts Comparison (DF3029F25V vs DF2623FA20JV vs DF2145BVFA10V vs DF3067RF20VTR)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case100-BFQFP100-BFQFP100-BFQFP100-BFQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-20°C ~ 75°C (TA)-40°C ~ 85°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)
Supply Voltage3V ~ 3.6V3V ~ 3.6V2.7V ~ 3.6V4.5V ~ 5.5V
Core ProcessorH8/300HH8S/2600H8S/2000H8/300H
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size16K x 812K x 88K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteObsolete
ConnectivitySCI, SmartCardCANbus, SCI, SmartCardHost Interface (LPC), I²C, IrDA, SCI, X-BusSCI, SmartCard
Data ConvertersA/D 8x10b; D/A 2x8bA/D 16x10b; D/A 2x8bA/D 8x10b; D/A 2x8bA/D 8x10b; D/A 2x8b
Number of I/O70537470
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