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Renesas DF2552FC26DV Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 512KB FLASH 144QFP

4,434 ActiveRenesas144-BFQFPRoHS
DF2552FC26DV 144-BFQFP package illustration

Same model may have multiple batches, images only for reference.

DF2552FC26DV
Manufacturer
Part Number (MPN)
DF2552FC26DV
Detailed Description
IC MCU 16BIT 512KB FLASH 144QFP
Package
144-BFQFP
Key Features
Package / Case: 144-BFQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DF2552FC26DV Datasheet
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Technical Specifications

Renesas DF2552FC26DV Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
H8® H8S/2500
RAM Size
32K x 8
RoHS
Yes
Package / Case
144-BFQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Active
Peripherals
POR, PWM, WDT
Number of I/O
104

Related Parts Comparison (DF2552FC26DV vs DF2339VFC25V vs DF2338VFC25V vs DF2556FC20DV)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case144-BFQFP144-BFQFP144-BFQFP144-BFQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 5.5V3V ~ 3.6V3V ~ 3.6V3V ~ 5.5V
Core ProcessorH8S/2000H8S/2000H8S/2000H8S/2000
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size32K x 832K x 88K x 832K x 8
Lifecycle StatusActiveObsoleteActiveNot For New Designs
ConnectivityI²C, SCISCI, SmartCardSCI, SmartCardCANbus, I²C, SCI
Data ConvertersA/D 16x10b; D/A 2x8bA/D 12x10b; D/A 4x8bA/D 12x10b; D/A 4x8bA/D 16x10b; D/A 2x8b
Number of I/O104106106104
Oscillator TypeInternalInternalInternalInternal
Action

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