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Renesas DF2329BVTE25V Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 384KB FLASH 120TQFP

10,603 ActiveRenesas120-TQFPRoHS
DF2329BVTE25V 120-TQFP package illustration

Same model may have multiple batches, images only for reference.

DF2329BVTE25V
Manufacturer
Part Number (MPN)
DF2329BVTE25V
Detailed Description
IC MCU 16BIT 384KB FLASH 120TQFP
Package
120-TQFP
Key Features
Package / Case: 120-TQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DF2329BVTE25V Datasheet
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Technical Specifications

Renesas DF2329BVTE25V Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
H8S/2329
RAM Size
32K x 8
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
RoHS
Yes
Package / Case
120-TQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Active

Related Parts Comparison (DF2329BVTE25V vs DF2364VTE34V vs DF2362VTE34V vs DF2357TE20V)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case120-TQFP120-TQFP120-TQFP120-TQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)
Supply Voltage2.7V ~ 3.6V3V ~ 3.6V3V ~ 3.6V4.5V ~ 5.5V
Core ProcessorH8S/2000H8S/2000H8S/2000H8S/2000
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size32K x 832K x 832K x 88K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveObsolete
ConnectivitySCI, SmartCardI²C, IrDA, SCI, SmartCardI²C, IrDA, SCI, SmartCardSCI, SmartCard
Data ConvertersA/D 8x10b; D/A 2x8bA/D 10x10b; D/A 2x8bA/D 10x10b; D/A 2x8bA/D 8x10b; D/A 2x8b
Number of I/O86838387
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