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Renesas DF2319VTE25V Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 512KB FLASH 100TQFP

2,422Renesas100-TQFPRoHS
DF2319VTE25V 100-TQFP package illustration

Same model may have multiple batches, images only for reference.

DF2319VTE25V
Manufacturer
Part Number (MPN)
DF2319VTE25V
Detailed Description
IC MCU 16BIT 512KB FLASH 100TQFP
Package
100-TQFP
Key Features
Package / Case: 100-TQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF DF2319VTE25V Datasheet
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Technical Specifications

Renesas DF2319VTE25V Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
H8S/2319
RAM Size
8K x 8
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
RoHS
Yes
Package / Case
100-TQFP
Mounting Type
Surface Mount
Operating Temperature
-20°C ~ 75°C (TA)
Supply Voltage
2.7V ~ 3.6V
Lifecycle Status
Obsolete

Alternate Parts Comparison (DF2319VTE25V vs DF2140BVTE10V vs DF2218CUTF24V vs DF2218UTF24V)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-TQFP100-TQFP100-TQFP100-TQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)-20°C ~ 75°C (TA)
Supply Voltage2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V2.7V ~ 3.6V
Core ProcessorH8S/2000H8S/2000H8S/2000H8S/2000
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size8K x 84K x 812K x 812K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteNot For New DesignsActiveNot For New Designs
ConnectivitySCI, SmartCardHost Interface (LPC), I²C, IrDA, SCI, X-BusSCI, SmartCard, USBSCI, SmartCard, USB
Data ConvertersA/D 8x10b; D/A 2x8bA/D 8x10b; D/A 2x8bA/D 6x10bA/D 6x10b
Number of I/O70746969
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