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onsemi NV25256DWHFT3G Memory Integrated Circuit

EEPROM Memory IC 256Kbit SPI 10 MHz 80 ns 8-UDFN (2x3)

2,466 Activeonsemi8-UFDFN Exposed PadRoHS
NV25256DWHFT3G - No Image Available

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NV25256DWHFT3G
Manufacturer
Part Number (MPN)
NV25256DWHFT3G
Detailed Description
256 KB SPI SER CMOS EEPROM SOIC8
Package
8-UFDFN Exposed Pad
Key Features
Package / Case: 8-UFDFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF NV25256DWHFT3G Datasheet
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Technical Specifications

onsemi NV25256DWHFT3G Memory Integrated Circuit technical specifications.

General

Series
NV25256
Memory Size
256Kb (32K x 8)
RoHS
ROHS3 Compliant
Package / Case
8-UFDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.8V ~ 5.5V
Lifecycle Status
Active
Technology
EEPROM
Memory Type
Non-Volatile

Alternate Parts Comparison (NV25256DWHFT3G vs NV24C08MUW3VLTBG vs NV24C08MUW3VTBG vs CAT25256HU4I-GT3)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-UFDFN Exposed Pad8-UFDFN Exposed Pad8-UFDFN Exposed Pad8-UFDFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)
Supply Voltage1.8V ~ 5.5V1.7V ~ 5.5V2.5V ~ 5.5V1.8V ~ 5.5V
Memory Size256Kb (32K x 8)8Kb (1K x 8)8Kbit256Kb (32K x 8)
Max Frequency10 MHz1 MHz400 kHz10 MHz
Memory FormatEEPROMEEPROMEEPROMEEPROM
Memory InterfaceSPII²CI²CSPI
Memory TypeNon-VolatileNon-VolatileNon-VolatileNon-Volatile
TechnologyEEPROMEEPROMEEPROMEEPROM
Write Cycle Time Word Page5ms4ms4ms5ms
RoHSROHS3 CompliantCompliantCompliant--
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