onsemi NIS5132MN3TXG Microcontrollers
High Performance Electronic Fuse
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
NIS5132MN3TXG
Detailed Description
High Performance Electronic Fuse
Package
10-VFDFN Exposed Pad
Lifecycle Status
Not For New Designs
Datasheet
NIS5132MN3TXG Datasheet
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Technical Specifications
onsemi NIS5132MN3TXG Microcontrollers technical specifications.
General
RoHS
Yes
Package / Case
10-VFDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 150°C
Lifecycle Status
Not For New Designs
Input Voltage
9V ~ 18V
Output Current
3.6A
Sensing Method
High-Side
Function
Electronic Fuse
Compliance
PbAHP
Alternate Parts Comparison (NIS5132MN3TXG vs NIS5232MN1TXG vs NCP3337MNADJR2G vs NCV8154MW180250TBG)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 10-VFDFN Exposed Pad | 10-VFDFN Exposed Pad | 10-VFDFN Exposed Pad | 10-VFDFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 150°C | -40°C ~ 150°C | -40°C ~ 85°C | -40°C ~ 125°C (TJ) |
| Lifecycle Status | Not For New Designs | Not For New Designs | Active | Active |
| Output Current | 3.6A | 4.2A | 500mA | 300mA, 300mA |
| RoHS | Yes | -- | Yes | Yes |
| Package | DFN-10 | -- | DFN-10 | DFN-10 |
| Action |
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