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onsemi NIS5132MN3TXG Microcontrollers

High Performance Electronic Fuse

150,000onsemi10-VFDFN Exposed Pad$1.11
NIS5132MN3TXG 10-VFDFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

NIS5132MN3TXG
Manufacturer
Part Number (MPN)
NIS5132MN3TXG
Detailed Description
High Performance Electronic Fuse
Package
10-VFDFN Exposed Pad
Lifecycle Status
Not For New Designs
Datasheet
PDF NIS5132MN3TXG Datasheet
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Technical Specifications

onsemi NIS5132MN3TXG Microcontrollers technical specifications.

General

RoHS
Yes
Package / Case
10-VFDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 150°C
Lifecycle Status
Not For New Designs
Input Voltage
9V ~ 18V
Output Current
3.6A
Sensing Method
High-Side
Function
Electronic Fuse
Compliance
PbAHP

Alternate Parts Comparison (NIS5132MN3TXG vs NIS5232MN1TXG vs NCP3337MNADJR2G vs NCV8154MW180250TBG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case10-VFDFN Exposed Pad10-VFDFN Exposed Pad10-VFDFN Exposed Pad10-VFDFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 150°C-40°C ~ 150°C-40°C ~ 85°C-40°C ~ 125°C (TJ)
Lifecycle StatusNot For New DesignsNot For New DesignsActiveActive
Output Current3.6A4.2A500mA300mA, 300mA
RoHSYes--YesYes
PackageDFN-10--DFN-10DFN-10
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