NXP Semiconductors XC705B32CBE Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 32KB OTP 56PSDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC705B32CBE
Detailed Description
Package
56-SDIP (0.600", 15.24mm)
Key Features
Package / Case: 56-SDIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
Compliant
Datasheet
XC705B32CBE Datasheet
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Technical Specifications
NXP Semiconductors XC705B32CBE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
56-SDIP (0.600", 15.24mm)
Supplier Device Package
56-PSDIP
Peripherals
POR, WDT
Number of I/O
32
Speed
2.1MHz
EEPROM Size
256 x 8
Core Processor
HC05
RAM Size
528 x 8
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