NXP Semiconductors XC68HC705B32CB Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 32KB OTP 56PSDIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC68HC705B32CB
Detailed Description
IC MCU 8BIT 32KB OTP 56PSDIP
Package
56-SDIP (0.600", 15.24mm)
Key Features
Package / Case: 56-SDIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
XC68HC705B32CB Datasheet
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Technical Specifications
NXP Semiconductors XC68HC705B32CB Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
528 x 8
Package / Case
56-SDIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
POR, WDT
Number of I/O
32
Speed
2.1MHz
EEPROM Size
256 x 8
Alternate Parts Comparison (XC68HC705B32CB vs XC56L307VF160 vs XC850DECZT50BUR2 vs XC850DECVR50BUR2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 56-SDIP | 196-LBGA | 256-BBGA | 256-BBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 100°C | -40°C ~ 95°C (TA) | -40°C ~ 95°C (TA) |
| Core Processor | HC05 | -- | MPC8xx | MPC8xx |
| Speed | 2.1MHz | -- | 50MHz | 50MHz |
| Voltage IO | -- | 3.30V | 3.3V | 3.3V |
| Action |
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