NXP Semiconductors XC68HC58EGAR2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 28SOIC
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC68HC58EGAR2
Detailed Description
IC MCU 28SOIC
Package
28-SOIC (0.295", 7.50mm Width)
Key Features
Package / Case: 28-SOIC (0.295", 7.50mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
XC68HC58EGAR2 Datasheet
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Technical Specifications
NXP Semiconductors XC68HC58EGAR2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
28-SOIC
Mounting Type
Surface Mount
Lifecycle Status
Obsolete
Alternate Parts Comparison (XC68HC58EGAR2 vs XC850DECZT50BUR2 vs XC850DECVR50BUR2 vs XC705B32CFNE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 28-SOIC | 256-BBGA | 256-BBGA | 52-LCC |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Operating Temperature | -- | -40°C ~ 95°C (TA) | -40°C ~ 95°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | -- | MPC8xx | MPC8xx | HC05 |
| Speed | -- | 50MHz | 50MHz | 2.1MHz |
| Action |
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