NXP Semiconductors TDF8555J/N2,112 Amplifiers - Audio
IC AMPLIFIER DBS37P
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
TDF8555J/N2,112
Detailed Description
IC AMPLIFIER DBS37P
Package
37-SSIP Formed Leads
Key Features
Package / Case: 37-SSIP Formed Leads; Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
TDF8555J/N2,112 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors TDF8555J/N2,112 Amplifiers - Audio technical specifications.
General
Package / Case
37-SSIP Formed Leads
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
6V ~ 18V
Lifecycle Status
Obsolete
Type
Class AB
Output Type
4 Half Bridge
Max Output Power X Channels Load
64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
Alternate Parts Comparison (TDF8555J/N2,112 vs TDF8771AH/C1,518 vs TDF5140AP/C1,112 vs TDF5140AT/C1,118)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 37-SSIP Formed Leads | 44-QFP | 18-DIP | 20-SOIC |
| Mounting Type | Through Hole | Surface Mount | Through Hole | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 85°C | -30°C ~ 70°C (TA) | -30°C ~ 70°C (TA) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Supply Voltage | 6V ~ 18V | -- | 4V ~ 18V | 4V ~ 18V |
| Action |
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