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NXP Semiconductors SPC5566MVR144R Microcontroller, Microprocessor, FPGA Modules

NXP 32-Bit MCU, Power Arch Core

2,359 ActiveNXP Semiconductors416-BBGARoHS
SPC5566MVR144R 416-BBGA package illustration

Same model may have multiple batches, images only for reference.

SPC5566MVR144R
Manufacturer
Part Number (MPN)
SPC5566MVR144R
Detailed Description
NXP 32-Bit MCU, Power Arch Core
Package
416-BBGA
Key Features
Package / Case: 416-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF SPC5566MVR144R Datasheet
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Technical Specifications

NXP Semiconductors SPC5566MVR144R Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MPC55xx Qorivva
RAM Size
128K x 8
Package / Case
416-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.35V ~ 1.65V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Speed
144MHz
Core Processor
e200z6

Alternate Parts Comparison (SPC5566MVR144R vs SPC5645SF1VVUR vs SPC5674FF3MVR3R vs SPC5673FK0MVR2R)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case416-BBGA416-BBGA416-BBGA416-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.35V ~ 1.65V3V ~ 5.5V1.08V ~ 5.25V1.08V ~ 5.25V
Core Processore200z6e200z4de200z7e200z7
Core Size32-Bit32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size128K x 81.064M x 8256K x 8192K x 8
Lifecycle StatusActiveActiveActiveActive
ConnectivityCANbus, EBI/EMI, Ethernet, SCI, SPICANbus, I²C, LINbus, SCI, SPICANbus, SCI, SPICANbus, SCI, SPI
Data ConvertersA/D 40x12bA/D 20x10bA/D 64x12bA/D 64x12b
Oscillator TypeExternalInternalExternalExternal
PeripheralsDMA, POR, PWM, WDTDMA, POR, PWM, WDTDMA, POR, PWMDMA, POR, PWM
Action

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