NXP Semiconductors SPC5517EBMLQ66R Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 1.5MB FLASH 144LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
SPC5517EBMLQ66R
Detailed Description
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
Compliant
Datasheet
SPC5517EBMLQ66R Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors SPC5517EBMLQ66R Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Peripherals
DMA, POR, PWM, WDT
Number of I/O
111
Speed
66MHz
Core Processor
e200z0, e200z1
RAM Size
80K x 8
Program Memory Type
Flash
More in This Category
Browse related parts from the same category — sorted by series, manufacturer, and package similarity. These are not verified pin-to-pin substitutes.