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NXP Semiconductors SC68376BGMAB20 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT ROMLESS 160QFP

2,249NXP Semiconductors160-BQFPRoHS
SC68376BGMAB20 - No Image Available

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SC68376BGMAB20
Manufacturer
Part Number (MPN)
SC68376BGMAB20
Detailed Description
IC MCU 32BIT ROMLESS 160QFP
Package
160-BQFP
Key Features
Package / Case: 160-BQFP; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
PDF SC68376BGMAB20 Datasheet
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Technical Specifications

NXP Semiconductors SC68376BGMAB20 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
7.5K x 8
Data Bus Width
32 bit
RoHS
True
Package / Case
160-BQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
4.75V ~ 5.25V
Lifecycle Status
Not For New Designs
Peripherals
POR, PWM, WDT
Number of I/O
18

Alternate Parts Comparison (SC68376BGMAB20 vs SC68376BGVAB25 vs SC68376BACAB20 vs MCF5232CAB80)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case160-BQFP160-BQFP160-BQFP160-BQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage4.75V ~ 5.25V4.75V ~ 5.25V4.75V ~ 5.25V1.4V ~ 1.6V
Core ProcessorCPU32CPU32CPU32Coldfire V2
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size7.5K x 87.5K x 87.5K x 864K x 8
ConnectivityCANbus, EBI/EMI, SCI, SPICANbus, EBI/EMI, SCI, SPICANbus, EBI/EMI, SCI, SPICANbus, EBI/EMI, I²C, SPI, UART/USART
Number of I/O18181861
Oscillator TypeExternalExternalExternalExternal
PeripheralsPOR, PWM, WDTPOR, PWM, WDTPOR, PWM, WDTDMA, WDT
Program Memory TypeROMlessROMlessROMlessROMless
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

This part is listed as a cross for

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