NXP Semiconductors S9S12G48ACLF Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 48KB FLASH 48LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S12G48ACLF
Detailed Description
IC MCU 16BIT 48KB FLASH 48LQFP
Package
48-LQFP
Key Features
Package / Case: 48-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S9S12G48ACLF Datasheet
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Technical Specifications
NXP Semiconductors S9S12G48ACLF Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
4K x 8
RoHS
Yes
Package / Case
48-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3.13V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
40
Speed
25MHz
Alternate Parts Comparison (S9S12G48ACLF vs MM912F634CV2APR2 vs MC908GZ48CFAE vs MCF51QU64VLFR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-LQFP | 48-LQFP | 48-LQFP | 48-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 3.13V ~ 5.5V | 2.25V ~ 5.5V | 3V ~ 5.5V | 1.71V ~ 3.6V |
| Core Processor | 12V1 | S12 | HC08 | Coldfire V1 |
| RAM Size | 4K x 8 | 2K x 8 | 1.5K x 8 | 16K x 8 |
| Number of I/O | 40 | 9 | 37 | 35 |
| Program Memory Type | Flash | FLASH (32kB) | Flash | Flash |
| Core Size | 16-Bit | -- | 8-Bit | 32-Bit Single-Core |
| Connectivity | CANbus, IrDA, LINbus, SCI, SPI | -- | CANbus, SCI, SPI | EBI/EMI, I²C, SPI, UART/USART |
| Data Converters | A/D 12x10b | -- | A/D 24x10b | A/D 13x12b; D/A 1x12b |
| Oscillator Type | Internal | -- | Internal | External |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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