NXP Semiconductors S9S08RN8W2MTG Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 8KB FLASH 16TSSOP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S08RN8W2MTG
Detailed Description
IC MCU 8BIT 8KB FLASH 16TSSOP
Package
16-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 16-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S9S08RN8W2MTG Datasheet
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Technical Specifications
NXP Semiconductors S9S08RN8W2MTG Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
RoHS
Yes
Package / Case
16-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
12
Speed
20MHz
Alternate Parts Comparison (S9S08RN8W2MTG vs PCA9557PW,118 vs MC68HC908QY2CDT vs MC9S08SE8CTG)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-TSSOP | 16-TSSOP | 16-TSSOP | 16-TSSOP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.3V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Number of I/O | 12 | 8 | 13 | 14 |
| Core Processor | S08 | -- | HC08 | S08 |
| Core Size | 8-Bit | -- | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | -- | 128 x 8 | 512 x 8 |
| Data Converters | A/D 8x10b | -- | A/D 4x8b | A/D 10x10b |
| Oscillator Type | Internal | -- | Internal | Internal |
| Peripherals | LVD, POR, PWM, WDT | -- | LVD, POR, PWM | LVD, POR, PWM |
| Program Memory Size | 8KB (8K x 8) | -- | 1.5KB (1.5K x 8) | 8KB (8K x 8) |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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