NXP Semiconductors S9S08DV60F2MLH Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 60KB FLASH 64LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S9S08DV60F2MLH
Detailed Description
IC MCU 8BIT 60KB FLASH 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
S9S08DV60F2MLH Datasheet
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Technical Specifications
NXP Semiconductors S9S08DV60F2MLH Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
3K x 8
RoHS
Yes
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
LVD, POR, PWM, WDT
Number of I/O
53
Speed
40MHz
Alternate Parts Comparison (S9S08DV60F2MLH vs S9S12P64J0VLHR vs SPC5602BK0MLH6R vs S9KEAZN16AMLHR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LQFP | 64-LQFP | 64-LQFP | 64-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 1.72V ~ 5.5V | 3V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | S08 | HCS12 | e200z0h | ARM® Cortex®-M0+ |
| Core Size | 8-Bit | 16-Bit | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | 3K x 8 | 4K x 8 | 24K x 8 | 2K x 8 |
| Lifecycle Status | Active | Active | Active | Active |
| Connectivity | CANbus, I²C, LINbus, SCI, SPI | CANbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | I²C, LINbus, SPI, UART/USART |
| Data Converters | A/D 16x12b | A/D 10x12b | A/D 12x10b | A/D 16x12b SAR |
| Number of I/O | 53 | 49 | 45 | 57 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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