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NXP Semiconductors S912ZVML64AWKHR Microcontroller, Microprocessor, FPGA Modules

S12Z CORE, 64K FLASH, LIN, 64LQF

19,800 ActiveNXP Semiconductors64-LQFP Exposed PadRoHS
S912ZVML64AWKHR 64-LQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

S912ZVML64AWKHR
Manufacturer
Part Number (MPN)
S912ZVML64AWKHR
Detailed Description
S12Z CORE, 64K FLASH, LIN, 64LQF
Package
64-LQFP Exposed Pad
Key Features
Package / Case: 64-LQFP Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S912ZVML64AWKHR Datasheet
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Technical Specifications

NXP Semiconductors S912ZVML64AWKHR Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
S12
RAM Size
4K x 8
RoHS
Yes
Package / Case
64-LQFP Exposed Pad
Operating Temperature
-40°C ~ 150°C (TA)
Supply Voltage
3.5V ~ 40V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Speed
50MHz
Connectivity
CANbus, LINbus, SCI, SPI

Alternate Parts Comparison (S912ZVML64AWKHR vs S912ZVMC12F1MKHR vs S912ZVML12F1VKHR vs S912ZVML64F2WKHR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad
Operating Temperature-40°C ~ 150°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 150°C (TA)
Supply Voltage3.5V ~ 40V3.5V ~ 40V3.5V ~ 40V3.5V ~ 40V
Core ProcessorS12ZS12ZS12ZS12Z
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size4K x 88K x 88K x 84K x 8
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteObsolete
ConnectivityCANbus, LINbus, SCI, SPICANbus, SCI, SPILINbus, SCI, SPICANbus, LINbus, SCI, SPI
Data ConvertersA/D 9x12b SARA/D 9x12bA/D 9x12bA/D 9x12b
EEPROM Size512 x 8512 x 8512 x 8512 x 8
Number of I/O24313131
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