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NXP Semiconductors S912ZVML32F3MKH Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 32KB FLASH 64LQFP

1,484 ActiveNXP Semiconductors64-LQFP Exposed PadRoHS
S912ZVML32F3MKH 64-LQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

S912ZVML32F3MKH
Manufacturer
Part Number (MPN)
S912ZVML32F3MKH
Detailed Description
IC MCU 16BIT 32KB FLASH 64LQFP
Package
64-LQFP Exposed Pad
Key Features
Package / Case: 64-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S912ZVML32F3MKH Datasheet
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Technical Specifications

NXP Semiconductors S912ZVML32F3MKH Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
4K x 8
RoHS
Yes
Package / Case
64-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.5V ~ 40V
Lifecycle Status
Active
Peripherals
DMA, POR, PWM, WDT
Number of I/O
31
Speed
50MHz

Alternate Parts Comparison (S912ZVML32F3MKH vs S912ZVMC12F1MKHR vs S912ZVML12F1VKHR vs S912ZVML64F2WKHR)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)-40°C ~ 150°C (TA)
Supply Voltage3.5V ~ 40V3.5V ~ 40V3.5V ~ 40V3.5V ~ 40V
Core ProcessorS12ZS12ZS12ZS12Z
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size4K x 88K x 88K x 84K x 8
ConnectivityCANbus, LINbus, SCI, SPICANbus, SCI, SPILINbus, SCI, SPICANbus, LINbus, SCI, SPI
Data ConvertersA/D 9x12bA/D 9x12bA/D 9x12bA/D 9x12b
EEPROM Size512 x 8512 x 8512 x 8512 x 8
Number of I/O31313131
Oscillator TypeInternalInternalInternalInternal
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

This part is listed as a cross for

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