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NXP Semiconductors P89LPC930FDH,129 Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 4KB FLASH 28TSSOP

10,357NXP Semiconductors28-TSSOP (0.173", 4.40mm Width)RoHS
P89LPC930FDH,129 28-TSSOP (0.173", 4.40mm Width) package illustration

Same model may have multiple batches, images only for reference.

P89LPC930FDH,129
Manufacturer
Part Number (MPN)
P89LPC930FDH,129
Detailed Description
IC MCU 8BIT 4KB FLASH 28TSSOP
Package
28-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 28-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF P89LPC930FDH,129 Datasheet
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Technical Specifications

NXP Semiconductors P89LPC930FDH,129 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC900
RAM Size
256 x 8
RoHS
Yes
Package / Case
28-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.4V ~ 3.6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O
26

Related Parts Comparison (P89LPC930FDH,129 vs P89LPC935FDH,529 vs P89LPC935FDH,518 vs MC908QC16CDRE)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case28-TSSOP28-TSSOP28-TSSOP28-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.4V ~ 3.6V2.4V ~ 3.6V2.4V ~ 3.6V3V ~ 5.5V
Core Processor805180518051HC08
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size256 x 8768 x 8768 x 8512 x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
ConnectivityI²C, SPI, UART/USARTI²C, SPI, UART/USARTI²C, SPI, UART/USARTSCI, SPI
Number of I/O26262624
Oscillator TypeInternalInternalInternalInternal
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