NXP Semiconductors P89C51RC2BN/01,112 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 32KB FLASH 40DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P89C51RC2BN/01,112
Detailed Description
IC MCU 8BIT 32KB FLASH 40DIP
Package
40-DIP (0.600", 15.24mm)
Key Features
Package / Case: 40-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
P89C51RC2BN/01,112 Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors P89C51RC2BN/01,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
89C
RAM Size
512 x 8
RoHS
True
Package / Case
40-DIP
Mounting Type
Through Hole
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
POR, PWM, WDT
Number of I/O
32
Alternate Parts Comparison (P89C51RC2BN/01,112 vs MC68HC705SR3CP vs P80C51FA-4N,112 vs P80C31X2BN,112)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 40-DIP | 40-DIP | 40-DIP | 40-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 4.5V ~ 5.5V | 3V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | 8051 | HC05 | 8051 | 8051 |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 512 x 8 | 192 x 8 | 256 x 8 | 128 x 8 |
| Number of I/O | 32 | 32 | 32 | 32 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, PWM, WDT | LED, POR | POR, PWM | POR |
| Program Memory Type | Flash | OTP | ROMless | ROMless |
| Speed | 33MHz | 4MHz | 16MHz | 33MHz |
| Action |
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