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NXP Semiconductors P87LPC760BDH,112 Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 1KB OTP 14TSSOP

8,800NXP Semiconductors14-TSSOP (0.173", 4.40mm Width)RoHS
P87LPC760BDH,112 14-TSSOP (0.173", 4.40mm Width) package illustration

Same model may have multiple batches, images only for reference.

P87LPC760BDH,112
Manufacturer
Part Number (MPN)
P87LPC760BDH,112
Detailed Description
IC MCU 8BIT 1KB OTP 14TSSOP
Package
14-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 14-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF P87LPC760BDH,112 Datasheet
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Technical Specifications

NXP Semiconductors P87LPC760BDH,112 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
LPC700
RAM Size
128 x 8
RoHS
Yes
Package / Case
14-TSSOP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.7V ~ 6V
Lifecycle Status
Obsolete
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Number of I/O
12

Alternate Parts Comparison (P87LPC760BDH,112 vs NTS0104PW,118 vs GTL2014PW,118 vs PCA21125T/Q900/1,1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case14-TSSOP14-TSSOP14-TSSOP14-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature0°C ~ 70°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C
Lifecycle StatusObsoleteActiveObsoleteActive
RoHSYesYesYes--
PackageSOT402-114-TSSOPTSSOP-14--
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