NXP Semiconductors P80C554SBBD,157 Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT ROMLESS 64LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
P80C554SBBD,157
Detailed Description
IC MCU 8BIT ROMLESS 64LQFP
Package
64-LQFP
Key Features
Package / Case: 64-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
P80C554SBBD,157 Datasheet
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Technical Specifications
NXP Semiconductors P80C554SBBD,157 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
512 x 8
Package / Case
64-LQFP
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.7V ~ 5.5V
Peripherals
POR, PWM, WDT
Number of I/O
40
Speed
16MHz
Core Processor
8051
Program Memory Type
ROMless
Alternate Parts Comparison (P80C554SBBD,157 vs S9S12P64J0VLHR vs SPC5602BK0MLH6R vs S9KEAZN16AMLHR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 64-LQFP | 64-LQFP | 64-LQFP | 64-LQFP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 1.72V ~ 5.5V | 3V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | 8051 | HCS12 | e200z0h | ARM® Cortex®-M0+ |
| Core Size | 8-Bit | 16-Bit | 32-Bit Single-Core | 32-Bit Single-Core |
| RAM Size | 512 x 8 | 4K x 8 | 24K x 8 | 2K x 8 |
| Connectivity | EBI/EMI, I²C, UART/USART | CANbus, SCI, SPI | CANbus, I²C, LINbus, SCI, SPI | I²C, LINbus, SPI, UART/USART |
| Data Converters | A/D 7x10b | A/D 10x12b | A/D 12x10b | A/D 16x12b SAR |
| Number of I/O | 40 | 49 | 45 | 57 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, PWM, WDT | LVD, POR, PWM, WDT | DMA, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Action |
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