NXP Semiconductors MPF5030BMMA0ES Power Management - Specialized
PMIC 3 BUCKS 2 LDO A1 DIE
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPF5030BMMA0ES
Detailed Description
PMIC 3 BUCKS 2 LDO A1 DIE
Package
40-PowerVFQFN
Key Features
Package / Case: 40-PowerVFQFN; Mounting Type: Surface Mount, Wettable Flank
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MPF5030BMMA0ES Datasheet
Quick Jump:
Technical Specifications
NXP Semiconductors MPF5030BMMA0ES Power Management - Specialized technical specifications.
General
Series
Automotive, AEC-Q100
RoHS
Yes
Package / Case
40-PowerVFQFN
Mounting Type
Surface Mount, Wettable Flank
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.3V ~ 5.25V
Lifecycle Status
Active
Application
System Basis Chip
Type
Multi-Channel PMIC
Output Current
3.5 A
Alternate Parts Comparison (MPF5030BMMA0ES vs MPF5032BMMA5ES vs MPF5030BMMA4ES vs MPF5030BMDA0ES)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 40-PowerVFQFN | 40-PowerVFQFN | 40-PowerVFQFN | 40-PowerVFQFN |
| Mounting Type | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 3.3V ~ 5.25V | 3.3V ~ 5.25V | 3.3V ~ 5.25V | 3.3V ~ 5.25V |
| Application | System Basis Chip | System Basis Chip | System Basis Chip | System Basis Chip |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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