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NXP Semiconductors MPC859DSLCZP66A Microcontroller, Microprocessor, FPGA Modules

IC MPU MPC8XX 66MHZ 357BGA

36,812NXP Semiconductors357-BBGARoHS
MPC859DSLCZP66A 357-BBGA package illustration

Same model may have multiple batches, images only for reference.

MPC859DSLCZP66A
Manufacturer
Part Number (MPN)
MPC859DSLCZP66A
Detailed Description
IC MPU MPC8XX 66MHZ 357BGA
Package
357-BBGA
Key Features
Package / Case: 357-BBGA
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MPC859DSLCZP66A Datasheet
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Technical Specifications

NXP Semiconductors MPC859DSLCZP66A Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RoHS
Yes
Package / Case
357-BBGA
Operating Temperature
-40°C ~ 100°C (TA)
Lifecycle Status
Obsolete
Voltage IO
3.3V
Speed
66MHz
Core Processor
MPC8xx
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Communications; CPM
RAM Controllers
DRAM

Alternate Parts Comparison (MPC859DSLCZP66A vs MPC8241LZQ166D vs MPC8241TZQ200D vs MPC885CZP133)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case357-BBGA357-BBGA357-BBGA357-BBGA
Operating Temperature-40°C ~ 100°C (TA)0°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 100°C (TA)
Core ProcessorMPC8xxPowerPC 603ePowerPC 603eMPC8xx
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
Graphics AccelerationNoNoNoNo
Number of Cores Bus Width1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit
RAM ControllersDRAMSDRAMSDRAMDRAM
Speed66MHz166MHz200MHz133MHz
Voltage IO3.3V3.3V3.3V3.3V
RoHSYesYesYes--
Package357-BBGAPBGA-357357-BBGA--
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