NXP Semiconductors MPC8347EVRAGDB Microcontroller, Microprocessor, FPGA Modules
IC MPU MPC83XX 400MHZ 620BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MPC8347EVRAGDB
Detailed Description
IC MPU MPC83XX 400MHZ 620BGA
Package
620-BBGA Exposed Pad
Key Features
Package / Case: 620-BBGA Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MPC8347EVRAGDB Datasheet
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Technical Specifications
NXP Semiconductors MPC8347EVRAGDB Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RoHS
Yes
Package / Case
620-BBGA Exposed Pad
Operating Temperature
0°C ~ 105°C (TA)
Lifecycle Status
Active
Voltage IO
2.5V, 3.3V
Speed
400MHz
Core Processor
PowerPC e300
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Security; SEC
RAM Controllers
DDR
Alternate Parts Comparison (MPC8347EVRAGDB vs MPC8315VRAGDA vs MPC8343CZQAGDB vs MPC8347CZQAGD)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 620-BBGA Exposed Pad | 620-BBGA Exposed Pad | 620-BBGA Exposed Pad | 620-BBGA Exposed Pad |
| Operating Temperature | 0°C ~ 105°C (TA) | 0°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
| Core Processor | PowerPC e300 | PowerPC e300c3 | PowerPC e300 | PowerPC e300 |
| Ethernet | 10/100/1000Mbps (2) | 10/100/1000Mbps (2) | 10/100/1000Mbps (3) | 10/100/1000Mbps (2) |
| Graphics Acceleration | No | No | No | No |
| Number of Cores Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| RAM Controllers | DDR | DDR, DDR2 | DDR, DDR2 | DDR |
| Speed | 400MHz | 400MHz | 400MHz | 400MHz |
| USB | USB 2.0 + PHY (2) | USB 2.0 + PHY (1) | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) |
| Voltage IO | 2.5V, 3.3V | 1.8V, 2.5V, 3.3V | 1.8V, 2.5V, 3.3V | 2.5V, 3.3V |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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