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NXP Semiconductors MPC555LFCVR40 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 448KB FLASH 272PBGA

2,618NXP Semiconductors272-BBGARoHS
MPC555LFCVR40 272-BBGA package illustration

Same model may have multiple batches, images only for reference.

MPC555LFCVR40
Manufacturer
Part Number (MPN)
MPC555LFCVR40
Detailed Description
IC MCU 32BIT 448KB FLASH 272PBGA
Package
272-BBGA
Key Features
Package / Case: 272-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
PDF MPC555LFCVR40 Datasheet
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Technical Specifications

NXP Semiconductors MPC555LFCVR40 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
26K x 8
RoHS
Yes
Package / Case
272-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Not For New Designs
Peripherals
POR, PWM, WDT
Number of I/O
101
Speed
40MHz

Alternate Parts Comparison (MPC555LFCVR40 vs MPC5200CVR400 vs MPC5200CBV266 vs MPC5200CVR400B)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case272-BBGA272-BBGA272-BBGA272-BBGA
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Core ProcessorPowerPCPowerPC G2_LEPowerPC G2_LEPowerPC e300
RoHSYesYesYesYes
Lifecycle StatusNot For New DesignsNot For New DesignsObsoleteNot For New Designs
PackageSOT698-2272-BBGA272-BBGABGA-272
Speed40MHz400MHz266MHz400MHz
Pack DescTray, Bakeable, Multiple in DrypackReel 13" Q1/T1 in Drypack--Reel 13" Q1/T1 in Drypack
Pack TypeTRAYREEL--REEL
Price FlgNY--Y
Ethernet--10/100Mbps (1)10/100Mbps (1)10/100Mbps (1)
Graphics Acceleration--NoNoNo
Action

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