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NXP Semiconductors MM912H634CM1AER2 Microcontroller, Microprocessor, FPGA Modules

IC 64KS12 LIN2XLS/HS ISENSE

4,548NXP Semiconductors48-LQFP Exposed PadRoHS
MM912H634CM1AER2 - No Image Available

Same model may have multiple batches, images only for reference.

MM912H634CM1AER2
Manufacturer
Part Number (MPN)
MM912H634CM1AER2
Detailed Description
IC 64KS12 LIN2XLS/HS ISENSE
Package
48-LQFP Exposed Pad
Key Features
Package / Case: 48-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MM912H634CM1AER2 Datasheet
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Technical Specifications

NXP Semiconductors MM912H634CM1AER2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Interface
LIN, SCI
RAM Size
6K x 8
Package / Case
48-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Supply Voltage
2.25V ~ 5.25V
Number of I/O
9
Core Processor
S12
Program Memory Type
FLASH (64kB)
Controller Series
HCS12

Alternate Parts Comparison (MM912H634CM1AER2 vs MM912F634CV1AER2 vs MM912F634CV2AER2 vs MM912F634CV2AE)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case48-LQFP Exposed Pad48-LQFP Exposed Pad48-LQFP Exposed Pad48-LQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 105°C-40°C ~ 105°C-40°C ~ 105°C
Supply Voltage2.25V ~ 5.25V2.25V ~ 5.5V2.25V ~ 5.5V2.25V ~ 5.5V
InterfaceLIN, SCILIN, SCILIN, SCILIN, SCI
Core ProcessorS12S12S12S12
RAM Size6K x 82K x 82K x 82K x 8
ApplicationsAutomotiveAutomotiveAutomotiveAutomotive
Controller SeriesHCS12HCS12HCS12HCS12
Number of I/O9999
Program Memory TypeFLASH (64kB)FLASH (32kB)FLASH (32kB)FLASH (32kB)
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