NXP Semiconductors MFS8601BMBA0ES Power Management - Specialized
IC FS86 SYSTEM BASIS CHIP ASIL
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MFS8601BMBA0ES
Detailed Description
IC FS86 SYSTEM BASIS CHIP ASIL
Package
48-VFQFN Exposed Pad
Key Features
Package / Case: 48-VFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MFS8601BMBA0ES Datasheet
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Technical Specifications
NXP Semiconductors MFS8601BMBA0ES Power Management - Specialized technical specifications.
General
Package / Case
48-VFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
4.5V ~ 60V
Applications
Camera
Alternate Parts Comparison (MFS8601BMBA0ES vs MPF7100BVMA0ES vs MC32PF3000A1EPR2 vs MC34PF3000A0EPR2)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount, Wettable Flank | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C | -40°C ~ 105°C |
| Supply Voltage | 4.5V ~ 60V | 2.5V ~ 5.5V | 2.8V ~ 5.5V | 2.8V ~ 5.5V |
| Applications | Camera | i.MX Processors | i.MX Processors | i.MX Processors |
| Action |
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