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NXP Semiconductors MCIMX6X3CVK08AC Microcontroller, Microprocessor, FPGA Modules

I.MX 6SX ROM PERF ENHAN

2,164 ActiveNXP Semiconductorsi.MX6D400-LFBGARoHS
MCIMX6X3CVK08AC 400-LFBGA package illustration

Same model may have multiple batches, images only for reference.

MCIMX6X3CVK08AC
Manufacturer
Part Number (MPN)
MCIMX6X3CVK08AC
Series
Detailed Description
I.MX 6SX ROM PERF ENHAN
Package
400-LFBGA
Key Features
Package / Case: 400-LFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MCIMX6X3CVK08AC Datasheet
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Technical Specifications

NXP Semiconductors MCIMX6X3CVK08AC Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
i.MX6SX
RAM Size
144 kB
Data Bus Width
32 bit
Maximum Clock Frequency
227 MHz, 800 MHz
RoHS
Yes
Package / Case
400-LFBGA
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
950 mV ~ 1.5 V
Lifecycle Status
Active

Alternate Parts Comparison (MCIMX6X3CVK08AC vs MCIMX6D4AVT08AER vs MCIMX6Q6AVT10AC vs MCIMX6D6AVT10AD)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case400-LFBGA624-FBGA624-FBGA624-FBGA
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 125°C (TJ)-40°C ~ 125°C (TJ)-40°C ~ 125°C (TJ)
Core ProcessorARM® Cortex®-A9, ARM® Cortex®-M4ARM® Cortex®-A9ARM® Cortex®-A9ARM® Cortex®-A9
RoHSYesYesYesYes
Lifecycle StatusActiveActiveNot For New DesignsActive
Co Processors DSPMultimedia; NEON™ MPEMultimedia; NEON™ SIMDMultimedia; NEON™ SIMDMultimedia; NEON™ SIMD
Display and Interface ControllersKeypad, LCDKeypad, LCDKeypad, LCDKeypad, LCD
Ethernet10/100/1000Mbps (2)10/100/1000Mbps (1)10/100/1000Mbps (1)10/100/1000Mbps (1)
Graphics AccelerationYesYesYesYes
Number of Cores Bus Width2 Core, 32-Bit2 Core, 32-Bit4 Core, 32-Bit2 Core, 32-Bit
PackageMAPBGA-400FCPBGA-624624-FBGA,FCBGASOT1643-1
RAM ControllersDDR3, LPDDR2, LVDDR3LPDDR2, LVDDR3, DDR3LPDDR2, LVDDR3, DDR3LPDDR2, LVDDR3, DDR3
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